Which equipments does Corona use to guarantee the quality?

Our in-house analyses laboratory carries out regular tests on production processes and equipments to ensure that high standards are achieved.
Some of the specialised equipment needed to achieve the above, are listed below.

Phoenix X-ray
This equipment is for X-ray inspection, enabling us to verify alignment, multilayer lay-up and drilling precision. In addition, it allows us to carry out measurement and inspection of soldered joints. It is an indispensable tool for production of multilayer printed circuit boards that have complex inner layers structures.

Fischer scope
Equipment used to measure superficial thickness of Gold, Nickel, Tin, Tin/Lead and also alloy composition.
It can establish very low values not definable with metallographic section.
Being a not destructive test, it is executed as a routine control.

Ohmegameter
Equipment for measurements of Surface Ionic Contamination, in accordance with MIL 55110.
This instrument determines whether contaminants or residues are present, both before and after component assembly.
Contaminants and residues can seriously affect the reliability and operation of circuit boards, particularly where high voltages or high humidity are present.
Contamination, if left on the board, could lead to electrolytic corrosion and subsequent failure.

Time Domain Reflectometer (TDR)
Equipment used for impedance measurement.
It allows you to verify the ohmic values on the internal and external lines to determine their influence on the signals passing through them.
This control allows you to verify the impedance values on the finished board compared with the values planned in the project phase.
It is absolutely necessary on boards with components working on high frequency signals.

Differential Scanning Calorimeter (DSC)
Equipment for Tg measurements.
It allows you to verify the base material quality and, above all, the correct polymerisation cycle used for multilayer pressing.