In which printed circuit boards technologies Corona is able to satisfy customer requirements?

We offer and specialise in the following multilayer printed circuits boards:

• with SMD and BGA minimum pitch 0,4 mm.

• for press-fit technology with a maximum thickness of 6,5 mm.

• with heatsink inside or outside

• where electrical test to a maximum of 250 V is requested

• with controlled and certified impedance

• with buried holes and blind microvias holes

• with Via Into Pad technology, pth microvia filled with resin

• rigid-flex

• with sequential build-up

• with plated edge and/or hole section

• with special materials

• with copper thickness over 105 micron.

• Blind via holes filled with plated copper